SMT gearkomste line Saki 3D Automated Optical Inspection Systems

Koarte beskriuwing:

3Di Series: Saki's 3Di Series tapast cutting edge technologyen te ferbetterjen produksje effisjinsje en ferbetterjen produksje kwaliteit oer de hiele gearkomste line.

3Xi Series / BF-X Series: Saki's 3D-AXI (X-Ray) searje foeget wichtige ynspeksjemooglikheid ta. It systeem brûkt Planar Computed Tomography (PCT) en leveret CT-ôfbylding mei hege presyzje op hege snelheid.

3Si Series: Saki's 3D SPI identifisearret krityske defekten en helpt mei prosesferbettering.

BF1-searje: Saki's unike line-scantechnology en koaksiale overheadljochting makket hege snelheid krekte ynspeksje mooglik.

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Produkt Detail

Produkt Tags

3D-AOI

PCB Grutte mm (yn.)	-	Single modus	-	Single modus	-
Ofmjittings	M Single Lane	M Dual Lane	L Single Lane	L Dual Lane	XL Single Lane
Model	3Di-MS2	3Di-MD2	3Di-LS2	3Di-LD2	3Di-ZS2
Model
Grutte (W) x (D) x (H) [Hoofdlichem] mm (yn.)	850 x 1430 x 1500 (33,46 x 56,30 x 59,06)		1040 x 1440 x 1500 (40,94 x 56,69 x 59,06)		1340 x 1440 x 1500 (52,75 x 56,69 x 59,06)
Gewicht	Ca. 850 kg, 1873.93 lbs		Ca. 900 kg, 1984.16 lbs
Elektryske Power Requirement	Ienfaze ~ 200-240V +/-10％, 50/60Hz
Resolúsje	7μm, 12μm, 18μm				18 μm
Air Requirement	0,5 MPa, 5 l/min (ANR)
	50 W x 60 L - 330 W x 330 L (1,97 Wx 2,36 L - 12,99 B x 12,99 L)	50 W x 60 L - 330 W x 330 L (1,97 W x 2,36L - 12,99 W x 12,99 L)	7µm kamerakop 50 W x 60 L - 330 W x 330 L (1,97 W x 2,36 L - 12,99 B x 12,99 L)	7µm kamerakop 50 W x 60 L - 330 W x 330 L (1,97 W x 2,36 L - 12,99 B x 12,99 L) 12/18 µm kamerakop 50 W x 60 L - 500 W x 510 L (1,97 W x 2,36 L - 19,68 B x 20,07 L)	50 W x 60 L - 686 W x 870 L (1,97 W x 2,36 L - 27,00 W x 34,25 L)
		Dual modus	-	Dual modus
		50 W x 60 L - 320 W x 330 L (1.97 W x 2.36L - 12.60 W x 12.99 L)	12/18 µm kamerakop 50 W x 60 L - 320 W x 330 L (1,97 W x 2,36 L - 12,60 W x 12,99 L)	7µm kamerakop 50 W x 60 L - 320 W x 330 L (1,97 W x 2,36 L - 12,60 W x 12,99 L) 12/18 µm kamerakop 50 W x 60 L - 320 W x 510 L (1,97 W x 2,36 L - 12,60 W x 20,07 L)
PCB Clearance	Top: 40 mm, 1.57 yn. Underkant: 60 mm, 2.36 yn.	Top: 40 mm, 1.57 yn. Underkant: 50 mm, 1.96 yn.	Top: 40 mm, 1.57 yn. Underkant: 60 mm, 2.36 yn.	Top: 40 mm, 1.57 yn. Underkant: 50 mm, 1.96 yn.	Top: 40 mm, 1.57 yn. Underkant: 60 mm, 2.36 yn.

3D-AXI

3Xi rige

Model	3Xi-M110	3Xi-M200
Model
Grutte (W) x (D) x (H) [Hoofdlichem] mm (yn.)	1380 x 2150 x 1500 (54,34 x 84,65 x 59,06)	1400 x 2580 x 1862 (55,12 x 101,58 x 73,31)
Gewicht	Ca. 3100 kg (6834.34 lbs)	Ca. 5100 kg (11243.58 lbs)
Elektryske Power Requirement	Trijefaze 200V +/ 10%, 50/60Hz 4,2 kVA Mei Kabel 5m
Resolúsje	10μm-30μm	25μm-80μm
Tube	110kV 30W, sletten X-ray Boarne	200kV 30W, Iepen röntgenbuis
Xray lekkage	0.5μSv/h of minder
Air Requirement	0.5MPa @ ≥ 20L/min (ANR)
Target PCB Grutte mm (yn.)	50 W x 120 L - 360 W x 330 L (1,97 W x 4,73 L - 14,17 B x 12,99 L) 50 W x 120 L - 360 W x 510 L ※ (1,97 W x 4,72 L - 14,17 W x 20,07 L)※	50 W x 140 L - 360 W x 330 L (1,97 W x 5,52 L - 14,17 B x 12,99 L) 50 W x 140 L - 360 W x 510 L ※ (1,97 W x 5,52 L - 14,17 W x 20,07 L)※
PCB Clearance	Top: 60 mm (2.36 in.) Underkant: 40 mm (1.57 yn.)

※ mei it tapassen fan de twa-stap ôfbyldingsopsje

BF-X Series

Model	BF-X2 (130KV/200KV)		BF-X3
Model
Ofmjittings (W) x (D) x (H) [Hoofdlichem] mm (yn.)	1820 x 2680 x 1880 (71,65 x 105,52 x 74,01)	1836 x 2680 x 1880 (72,28 x 105,51 x 74,01)	1820 x 2250 x 1880 (71,65 x 88,58 x 74,01)
Gewicht	Ca. 5500 kg (12125.43 lbs)	Ca. 6500 kg (14330.05 lbs)	Ca. 5200 kg (11464.04 lbs)
Elektryske Power Requirement	Trije faze fjouwerdraadsysteem 400V Y-ferbining 400V+/ 10%, 50/60Hz 7 kVA Kabel 5 m
Resolúsje	9µm-29µm	21µm-68µm	13μm-30μm
Tube	130kV 30W, Iepen röntgenbuis	200kV 30W, Iepen röntgenbuis	130kV 16W, sletten X-ray boarne
X-ray lekkage	0.5μSv/h of minder
Air Requirement	0.5MPa @ ≥ 60L/min (ANR)
Target PCB Grutte mm (yn.)	50 W x 120 L - 460 W x 510 L (1,97 x 4,72 - 18,11 x 20,08)	50 W x 140 L - 460 W x 510 L (1,97 x 5,51 - 18,11 x 20,08)	50 W x 120 L - 460 W x 510 L (1,97 x 4,72 - 18,11 x 20,08)
PCB Clearance	Top: 40 mm (1.57 in.) Underkant: 40 mm (1.57 yn.)

3D-SPI

PCB Grutte mm (yn.)	-	Single modus	-	Single modus	-
Ofmjittings	M Single Lane	M Dual Lane	L Single Lane	L Dual Lane	XL Single Lane
Model	3Si-MS2	3Si-MD2	3Si-LS2	3Si-LD2	3Si-ZS2
Model
Grutte (W) x (D) x (H) [Hoofdlichem] mm (yn.)	850 x 1430 x 1500 (33,46 x 56,30 x 59,06)		1040 x 1440 x 1500 (40,94 x 56,69 x 59,06)		1340 x 1440 x 1500 (52,75 x 56,69 x 59,06)
Gewicht	Ca. 850 kg, 1873.93 lbs		Ca. 900 kg, 1984.16 lbs
Elektryske Power Requirement	Ienfaze ~ 200-240V +/-10％, 50/60Hz
Resolúsje	7μm, 12μm, 18μm				18 μm
Air Requirement	0,5 MPa, 5 l/min (ANR)
	50 W x 60 L - 330 W x 330 L (1,97 Wx 2,36 L - 12,99 B x 12,99 L)	50 W x 60 L - 330 W x 330 L (1,97 W x 2,36L - 12,99 W x 12,99 L)	7µm kamerakop 50 W x 60 L - 330 W x 330 L (1,97 W x 2,36 L - 12,99 B x 12,99 L)	7µm kamerakop 50 W x 60 L - 330 W x 330 L (1,97 W x 2,36 L - 12,99 B x 12,99 L) 12/18 µm kamerakop 50 W x 60 L - 500 W x 510 L (1,97 W x 2,36 L - 19,68 B x 20,07 L)	50 W x 60 L - 686 W x 870 L (1,97 W x 2,36 L - 27,00 W x 34,25 L)
		Dual modus	-	Dual modus
		50 W x 60 L - 320 W x 330 L (1.97 W x 2.36L - 12.60 W x 12.99 L)	12/18 µm kamerakop 50 W x 60 L - 500 W x 510 L (1,97 W x 2,36L - 19,68 W x 20,07 L)	7µm kamerakop 50 W x 60 L - 320 W x 330 L (1,97 W x 2,36 L - 12,60 W x 12,99 L) 12/18 µm kamerakop 50 W x 60 L - 320 W x 510 L (1,97 W x 2,36 L - 12,60 W x 20,07 L)
PCB Clearance	Top: 40 mm, 1.57 yn. Underkant: 60 mm, 2.36 yn.	Top: 40 mm, 1.57 yn. Underkant: 50 mm, 1.96 yn.	Top: 40 mm, 1.57 yn. Underkant: 60 mm, 2.36 yn.	Top: 40 mm, 1.57 yn. Underkant: 50 mm, 1.96 yn.	Top: 40 mm, 1.57 yn. Underkant: 60 mm, 2.36 yn.

2D-AOI

Inline High-speed AOI

Model	BF-Frontier II
Model
Ofmjittings (W) x (D) x (H) [Hoofdlichem] mm (yn.)	850 x 1340 x 1230 (33,5 x 52,8 x 48,4)
Gewicht	Ca. 450 kg (992.1 lbs)
Elektryske Power Requirement	Ienfaze ~ 100-120/200-240V +/-10％, 50/60Hz
Resolúsje	18 μm
Air Requirement	0,5 MPa, 5 l/min (ANR)
Target PCB Grutte mm (yn.)	50 W x 60 L - 460 W x 500 L (2 W x 2,4 L - 18 W x 20 L)
PCB Clearance	Top: 40 mm (1.57 yn.) Underkant: 40 mm (1.57 yn.)

2D Bottom-side Automated Optical Inspection Machine

Model	2Di-LU1
Model
Ofmjittings (W) x (D) x (H) [Hoofdlichem] mm (yn.)	1040 x 1440 x 1500 (40,94 x 56,69 x 59,06)
Gewicht	Ca. 750 kg (1653.47 lbs)
Elektryske Power Requirement	Ienfaze ~ 200-240V +/-10%, 50/60Hz, 700VA
Resolúsje	18 μm
Air Requirement	0,5 MPa, 5 l/min (ANR)
Target PCB Grutte mm (yn.)	Carrier 50 W x 60 L - 610 W x 610 L (1,97 W x 2,36 L - 24,02 B x 24,02 L)Ynspeksjegebiet (Scan) 50 W x 60 L - 460 W x 500 L (1,97 W x 2,36 L - 18,11 B x 19,69 L)
PCB Clearance	Top: 30 mm (1.18 in.) Underkant: 30 mm (1.18 yn.)

Simultane twa-sided ynspeksje

Model	BF-Tristar II
Model
Ofmjittings (W) x (D) x (H) [Hoofdlichem] mm (yn.)	850 x 1295 x 1130 (33,5 x 51 x 45,5)
Gewicht	Ca. 450 kg (992.1 lbs)
Elektryske Power Requirement	Ienfaze ~ 100-120/200-240V +/-10％, 50/60Hz
Resolúsje	10 μm
Air Requirement	0,5 MPa, 5 l/min (ANR)
Target PCB Grutte mm (yn.)	50 W x 60 L - 250 W x 330 L (2 W x 2,4 L - 10 W x 13 L)
PCB Clearance	Top: 30 mm (1.18 in.) Underkant: 30 mm (1.18 yn.)

Desktop model

Model	BF-Sirius	BF-Comet18
Model
Ofmjittings (W) x (D) x (H) [Hoofdlichem] mm (yn.)	800 x 1280 x 600 (31,5 x 50,4 x 23,6)	580 x 850 x 452 (22,8 x 33,5 x 17,8)
Gewicht	Ca. 175 kg (385.8 lbs)	Ca. 80 kg (176,4 lbs)
Elektryske Power Requirement	Ienfaze ~ 100-120/200-240V +/-10％, 50/60Hz
Resolúsje	18 μm
Air Requirement	-
Target PCB Grutte mm (yn.)	50 W x 50 L - 460 W x 500 L (2 W x 2 L - 18 W x 20 L)	50 W x 50 L - 250 W x 330 L (2 W x 2 L - 10 W x 13 L)
PCB Clearance	Top: 40 mm (1.57 yn.) Underkant: 60 mm (2.36 yn.)